Cutting Techniques: Material Cutting and Slicing Processing
【Aluminum Nitride AlN / Alumina Al2O3 compatible】 A new technology that is becoming a global trend, fixed abrasive method!
At Shinko Seisakusho, mass production processing using the fixed abrasive method, which is becoming a global trend, is possible! We manufacture solar silicon wafers using the fixed abrasive method (diamond wire) with two types of materials: single crystal and polycrystalline. Currently, the yield rate for the fixed abrasive method has achieved over 95% on a mass production basis, with more than 4 million silicon wafers produced per month. 【Main Supported Materials】 Aluminum Nitride (AlN) / Alumina (Al2O3) / Sapphire / Silicon Carbide (SiC) / Copper (Cu) / Molybdenum (Mo) / Tungsten (W) / Copper Molybdenum / Copper Tungsten / Quartz Glass / Lithium Niobate (LiNbO3) / Lithium Tantalate (LiTaO3) / Barium Titanate (BaTiO3) / Zirconia (ZrO2) / Silicon Nitride (Si3N4) / Cemented Carbide (SK Material) / Ceramic Matrix Composites (CMC) *For more details, please download the PDF catalog or feel free to contact us.
- Company：新興製作所
- Price：Other
